View EBE10UE8AFFA_4535915.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DATA SHEET
1GB Unbuffered DDR2 SDRAM DIMM
EBE10UE8AFFA (128M words x 64 bits, 1 Rank)
Specifications
* Density: 1GB * Organization 128M words x 64 bits, 1 rank * Mounting 8 pieces of 1G bits DDR2 SDRAM sealed in FBGA * Package: 240-pin socket type dual in line memory module (DIMM) PCB height: 30.0mm Lead pitch: 1.0mm Lead-free (RoHS compliant) and Halogen-free * Power supply: VDD = 1.8V 0.1V * Data rate: 800Mbps/667Mbps (max.) * Eight internal banks for concurrent operation (components) * Interface: SSTL_18 * Burst lengths (BL): 4, 8 * /CAS Latency (CL): 3, 4, 5, 6 * Precharge: auto precharge option for each burst access * Refresh: auto-refresh, self-refresh * Refresh cycles: 8192 cycles/64ms Average refresh period 7.8s at 0C TC +85C 3.9s at +85C < TC +95C * Operating case temperature range TC = 0C to +95C
Features
* Double-data-rate architecture; two data transfers per clock cycle * The high-speed data transfer is realized by the 4 bits prefetch pipelined architecture * Bi-directional differential data strobe (DQS and /DQS) is transmitted/received with data for capturing data at the receiver * DQS is edge-aligned with data for READs; centeraligned with data for WRITEs * Differential clock inputs (CK and /CK) * DLL aligns DQ and DQS transitions with CK transitions * Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS * Data mask (DM) for write data * Posted /CAS by programmable additive latency for better command and data bus efficiency * Off-Chip-Driver Impedance Adjustment and On-DieTermination for better signal quality * /DQS can be disabled for single-ended Data Strobe operation
Document No. E1457E20 (Ver. 2.0) Date Published April 2009 (K) Japan Printed in Japan URL: http://www.elpida.com (c)Elpida Memory, Inc. 2009
EBE10UE8AFFA
Ordering Information
Data rate Mbps (max.) 800 667 Component JEDEC speed bin (CL-tRCD-tRP) DDR2-800 (6-6-6) DDR2-667 (5-5-5) Contact pad Gold
Part number EBE10UE8AFFA-8G-F EBE10UE8AFFA-6E-F
Package 240-pin DIMM (lead-free and halogen-free)
Mounted devices EDE1108AFSE-8E-F EDE1108AFSE-8E-F EDE1108AFSE-6E-F
Pin Configurations
Front side 1 pin 64 pin 65 pin 120 pin
121 pin Back side
184 pin 185 pin
240 pin
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
Pin name VREF VSS DQ0 DQ1 VSS /DQS0 DQS0 VSS DQ2 DQ3 VSS DQ8 DQ9 VSS /DQS1 DQS1 VSS NC NC VSS DQ10 DQ11 VSS DQ16 DQ17 VSS /DQS2 DQS2
Pin No. 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88
Pin name A4 VDD A2 VDD VSS VSS VDD NC VDD A10 BA0 VDD /WE /CAS VDD NC NC VDD VSS DQ32 DQ33 VSS /DQS4 DQS4 VSS DQ34 DQ35 VSS
Pin No. 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148
Pin name VSS DQ4 DQ5 VSS DM0 NC VSS DQ6 DQ7 VSS DQ12 DQ13 VSS DM1 NC VSS CK1 /CK1 VSS DQ14 DQ15 VSS DQ20 DQ21 VSS DM2 NC VSS
Pin No. 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208
Pin name VDD A3 A1 VDD CK0 /CK0 VDD A0 VDD BA1 VDD /RAS /CS0 VDD ODT0 A13 VDD VSS DQ36 DQ37 VSS DM4 NC VSS DQ38 DQ39 VSS DQ44
Data Sheet E1457E20 (Ver. 2.0)
2
EBE10UE8AFFA
Pin No. 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Pin name VSS DQ18 DQ19 VSS DQ24 DQ25 VSS /DQS3 DQS3 VSS DQ26 DQ27 VSS NC NC VSS NC NC VSS NC NC VSS VDD CKE0 VDD BA2 NC VDD A11 A7 VDD A5 Pin No. 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Pin name DQ40 DQ41 VSS /DQS5 DQS5 VSS DQ42 DQ43 VSS DQ48 DQ49 VSS SA2 NC VSS /DQS6 DQS6 VSS DQ50 DQ51 VSS DQ56 DQ57 VSS /DQS7 DQS7 VSS DQ58 DQ59 VSS SDA SCL Pin No. 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 Pin name DQ22 DQ23 VSS DQ28 DQ29 VSS DM3 NC VSS DQ30 DQ31 VSS NC NC VSS NC NC VSS NC NC VSS VDD NC VDD NC NC VDD A12 A9 VDD A8 A6 Pin No. 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 Pin name DQ45 VSS DM5 NC VSS DQ46 DQ47 VSS DQ52 DQ53 VSS CK2 /CK2 VSS DM6 NC VSS DQ54 DQ55 VSS DQ60 DQ61 VSS DM7 NC VSS DQ62 DQ63 VSS VDDSPD SA0 SA1
Data Sheet E1457E20 (Ver. 2.0)
3
EBE10UE8AFFA
Pin Description
Pin name A0 to A13 A10 (AP) BA0, BA1, BA2 DQ0 to DQ63 /RAS /CAS /WE /CS0 CKE0 CK0 to CK2 /CK0 to /CK2 DQS0 to DQS7, /DQS0 to /DQS7 DM0 to DM7 SCL SDA SA0 to SA2 VDD VDDSPD VREF VSS ODT0 NC Function Address input Row address Column address Auto precharge Bank select address Data input/output Row address strobe command Column address strobe command Write enable Chip select Clock enable Clock input Differential clock input Input and output data strobe Input mask Clock input for serial PD Data input/output for serial PD Serial address input Power for internal circuit Power for serial EEPROM Input reference voltage Ground ODT control No connection A0 to A13 A0 to A9
Data Sheet E1457E20 (Ver. 2.0)
4
EBE10UE8AFFA
Serial PD Matrix
Byte No. 0 1 2 3 4 5 6 7 8 9 Function described Number of bytes utilized by module manufacturer Total number of bytes in serial PD device Memory type Number of row address Number of column address Number of DIMM ranks Module data width Module data width continuation Voltage interface level of this assembly DDR SDRAM cycle time, CL = X -8G (CL = 6) -6E (CL = 5) 10 SDRAM access from clock (tAC) -8G -6E 11 12 13 14 15 16 17 18 DIMM configuration type Refresh rate/type Primary SDRAM width Error checking SDRAM width Reserved Bit7 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 Bit6 0 0 0 0 0 1 1 0 0 0 0 1 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 1 0 1 Bit5 0 0 0 0 0 1 0 0 0 1 1 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 1 0 0 1 0 Bit4 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 1 0 1 1 1 Bit3 0 1 1 1 1 0 0 0 0 0 0 0 0 0 0 1 0 0 1 1 0 1 0 0 0 0 0 1 0 0 1 0 Bit2 0 0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 1 1 0 1 0 Bit1 0 0 0 1 1 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 Bit0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 1 0 0 1 0 1 1 0 1 0 Hex value Comments 80H 08H 08H 0EH 0AH 60H 40H 00H 05H 25H 30H 40H 45H 00H 82H 08H 00H 00H 0CH 08H 70H 38H 01H 02H 00H 03H 30H 3DH 45H 50H 3DH 50H 128 bytes 256 bytes DDR2 SDRAM 14 10 1 64 0 SSTL 1.8V 2.5ns* 3.0ns* 0.4ns*
1
1
1
0.45ns* None 7.8s x8 None 0 4,8 8 4, 5, 6 3, 4, 5
1
SDRAM device attributes: 0 Burst length supported SDRAM device attributes: Number of 0 banks on SDRAM device SDRAM device attributes: /CAS latency 0 -8G -6E 0 0 0 0 0 0 0 0 0 0 0
19 20 21 22 23
DIMM Mechanical Characteristics DIMM type information SDRAM module attributes SDRAM device attributes: General Minimum clock cycle time at CL = X - 1 -8G (CL = 5) -6E (CL = 4) Maximum data access time (tAC) from clock at CL = X - 1 -8G (CL = 5) -6E (CL = 4) Minimum clock cycle time at CL = X - 2 -8G (CL = 4) -6E (CL = 3)
4.00mm max. Unbuffered Normal Weak Driver 50 ODT Support 3.0ns*
1
3.75ns* 0.45ns* 0.5ns*
1
1
24
1
25
3.75ns* 5.0ns*
1
1
Data Sheet E1457E20 (Ver. 2.0)
5
EBE10UE8AFFA
Byte No. 26
Function described Maximum data access time (tAC) from clock at CL = X - 2 -8G (CL = 4) -6E (CL = 3)
Bit7 0 0 0 0
Bit6 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0
Bit5 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 0 0 0 0 1 1 0 0 0 0 1 0
Bit4 1 0 1 1 1 0 0 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 1 1 1 0 0
Bit3 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 1 1 1 0 0 1 1 0 0 1 1 0 0
Bit2 0 0 1 1 1 1 0 1 0 1 1 1 0 0 1 1 1 1 0 1 1 1 0 1 0 1 0 0
Bit1 0 0 0 1 0 0 0 1 0 0 1 0 0 1 1 0 1 1 0 1 0 1 0 0 0 1 1 0
Bit0 0 0 0 0 0 1 1 1 0 1 1 1 0 0 1 0 0 0 0 0 0 1 0 0 0 0 0 0
Hex value Comments 50H 60H 3CH 1EH 3CH 2DH 01H 17H 20H 25H 27H 05H 10H 12H 17H 3CH 1EH 1EH 00H 06H 3CH 7FH 80H 14H 18H 1EH 22H 00H 60ns*
1
0.5ns* 0.6ns* 15ns 7.5ns 15ns 45ns
1
1
27 28 29 30 31 32
Minimum row precharge time (tRP) Minimum row active to row active delay (tRRD) Minimum active to precharge time (tRAS) Module rank density Address and command setup time before clock (tIS) -8G -6E Address and command hold time after clock (tIH) -8G -6E Data input setup time before clock (tDS) -8G -6E
Minimum /RAS to /CAS delay (tRCD) 0 0 0 0 0 0 0 0 0
1G bytes 0.17ns* 0.20ns* 0.25ns* 0.27ns* 0.05ns* 0.10ns* 0.12ns* 0.17ns* 15ns*
1 1
1
33
1
1
34
1
1
35
Data input hold time after clock (tDH) 0 -8G -6E 0 0
1
1
36 37 38 39 40 41 42 43 44
Write recovery time (tWR)
Internal write to read command delay 0 (tWTR) Internal read to precharge command 0 delay (tRTP) Memory analysis probe 0 characteristics Extension of Byte 41 and 42 Active command period (tRC) Auto refresh to active/ Auto refresh command cycle (tRFC) SDRAM tCK cycle max. (tCK max.) Dout to DQS skew -8G -6E Data hold skew (tQHS) -8G -6E 0 0 0 1 0 0 0 0 0
7.5ns* 7.5ns* TBD
1
1
127.5ns* 8ns*
1
1
0.20ns* 0.24ns* 0.30ns* 0.34ns*
1
1
45
1
1
46
PLL relock time
Undefined
Data Sheet E1457E20 (Ver. 2.0)
6
EBE10UE8AFFA
Byte No. 47 to 61 62 63
Function described
Bit7 0
Bit6 0 0 1 0 1 1 0 x 1 1 1 0 0 1 1 0 1 1 1 1 0 0 0 1 1 0 1 0 0 0 x x
Bit5 0 0 1 0 1 1 0 x 0 0 0 1 1 0 0 1 0 0 0 0 1 1 1 0 0 1 0 1 1 1 x x
Bit4 0 1 1 1 1 1 0 x 0 0 0 1 1 1 0 1 0 0 0 0 0 1 1 0 0 0 0 0 1 0 x x
Bit3 0 0 0 0 1 1 0 x 0 0 0 0 0 0 0 1 0 0 0 0 1 1 0 0 0 1 0 0 0 0 x x
Bit2 0 0 1 0 1 1 0 x 1 0 1 0 0 1 1 0 0 1 1 0 1 0 1 1 1 1 1 0 0 0 x x
Bit1 0 1 0 1 1 1 0 x 0 1 0 0 0 0 0 0 0 1 1 0 0 0 1 1 0 0 1 0 0 0 x x
Bit0 0 0 1 0 1 0 0 x 1 0 1 1 0 1 1 0 1 0 0 1 1 0 0 1 1 1 0 0 0 0 x x
Hex value Comments 00H 12H DCH 12H 7FH FEH 00H xx 45H 42H 45H 31H 30H 55H 45H 38H 41H 46H 46H 41H 2DH 38H 36H 47H 45H 2DH 46H 20H 30H 20H xx xx (ASCII-8bit code) E B E 1 0 U E 8 A F F A -- 8 6 G E -- F (Space) Initial (Space) Year code (BCD) Week code (BCD) Continuation code Elpida Memory Rev. 1.2
SPD Revision Checksum for bytes 0 to 62 -8G -6E
0 1 0 0 1 0 x 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 x x
64 to 65 66 67 to 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
Manufacturer's JEDEC ID code Manufacturer's JEDEC ID code Manufacturer's JEDEC ID code Manufacturing location Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number Module part number -8G -6E Module part number -8G -6E
87
88 89 90 91 92 93 94 95 to 98 99 to 127
Module part number Module part number Module part number Revision code Revision code Manufacturing date Manufacturing date Module serial number Manufacture specific data
Note: 1.
These specifications are defined based on component specification, not module.
Data Sheet E1457E20 (Ver. 2.0)
7
EBE10UE8AFFA
Block Diagram
/CS0
RS1 RS1
/DQS4
RS1 RS1 DQS4
RS1
/DQS0
DQS0
RS1
DM0
8
RS1
DM
/CS DQS /DQS
DM4
8
RS1
DM
/CS DQS /DQS
DQ0 to DQ7
DQ0 to DQ7
D0
DQ32 to DQ39
DQ0 to DQ7
D4
RS1 /DQS1
RS1 /DQS5
RS1
DQS1
RS1
RS1
DQS5
DM1
/CS DQS /DQS DM DQ0 to DQ7
RS1
DM5
/CS DQS /DQS DM DQ0 to DQ7
8
RS1
DQ8 to DQ15
D1
8
RS1
DQ40 to DQ47
D5
RS1 /DQS2
RS1 /DQS6
RS1
DQS2
RS1
/CS DQS /DQS DM
RS1
DQS6
RS1
/CS DQS /DQS DM DQ0 to DQ7
DM2
DM6
8
RS1
DQ16 to DQ23
DQ0 to DQ7
D2
8
RS1
DQ48 to DQ55
D6
RS1 /DQS3
/DQS7
RS1
RS1
DQS3
RS1
/CS DQS /DQS DM
RS1
DQS7
RS1
/CS DQS /DQS DM DQ0 to DQ7
DM3
8
RS1
DM7
DQ24 to DQ31
DQ0 to DQ7
D3
8
RS1
DQ56 to DQ63
D7
RS2
BA0 to BA2
RS2
BA0 to BA2: SDRAMs (D0 to D7)
A0 to A13: SDRAMs (D0 to D7)
RS2
Serial PD
SCL
SA0
SCL SDA
A0 to A13 /RAS
RS2
SDA
A0
A1 A2
/RAS: SDRAMs (D0 to D7)
SA1
/CAS: SDRAMs (D0 to D7)
RS2
U0
WP
/CAS /WE
SA2
/WE: SDRAMs (D0 to D7)
CKE0
ODT0
CKE: SDRAMs (D0 to D7)
ODT:SDRAMs (D0 to D7)
Notes : 1. DQ wiring maybe changed within a byte. 2. DQ, DQS, /DQS, ODT, DM, CKE, /CS relationships must be meintained as shown. 3. Refer to the appropriate clock wiring topology under the DIMM wiring details section of this document.
VDDSPD VREF
VDD
SPD
SDRAMs (D0 to D7)
SDRAMs (D0 to D7)
VSS
* D0 to D7 : 1G bits DDR2 SDRAM U0 : 2k bits EEPROM Rs1 : 22 Rs2 : 10
SDRAMs (D0 to D7)
Data Sheet E1457E20 (Ver. 2.0)
8
EBE10UE8AFFA
Logical Clock Net Structure
3DRAM loads (CK1 and /CK1, CK2 and /CK2)
R = 200
DRAM
C1
DRAM
C1
DIMM connector R = 200
R = 200
DRAM
C1
2DRAM loads (CK0 and /CK0)
R = 200
DRAM
C1
C2
DIMM connector R = 200
R = 200
DRAM
C1
* C1: 1pF C2: 2pF
Data Sheet E1457E20 (Ver. 2.0)
9
EBE10UE8AFFA
Electrical Specifications
* All voltages are referenced to VSS (GND). Absolute Maximum Ratings
Parameter Voltage on any pin relative to VSS Supply voltage relative to VSS Short circuit output current Power dissipation Operating case temperature Storage temperature Symbol VT VDD IOS PD TC Tstg Value -0.5 to +2.3 -0.5 to +2.3 50 8 0 to +95 -55 to +100 Unit V V mA W C C 1, 2 1 1 Notes 1
Notes: 1. 2.
DDR2 SDRAM component specification. Supporting 0C to +85C and being able to extend to +95C with doubling auto-refresh commands in frequency to a 32ms period (tREFI = 3.9s) and higher temperature self-refresh entry via the control of EMRS (2) bit A7 is required. Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Caution
DC Operating Conditions (TC = 0C to +85C) (DDR2 SDRAM Component Specification)
Parameter Supply voltage Symbol VDD, VDDQ VSS VDDSPD Input reference voltage Termination voltage DC input logic high DC input low AC input logic high AC input low VREF VTT VIH (DC) VIL (DC) VIH (AC) VIL (AC) min. 1.7 0 1.7 0.49 x VDDQ VREF - 0.04 VREF + 0.125 -0.3 VREF + 0.200 typ. 1.8 0 -- max. 1.9 0 3.6 Unit V V V V V V V V V 1, 2 3 Notes 4
0.50 x VDDQ 0.51 x VDDQ VREF VREF + 0.04 VDDQ + 0.3 VREF - 0.125 VREF - 0.200
Notes: 1.
2. 3. 4.
The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the value of VREF is expected to be about 0.5 x VDDQ of the transmitting device and VREF are expected to track variations in VDDQ. Peak to peak AC noise on VREF may not exceed 2% VREF (DC). VTT of transmitting device must track VREF of receiving device. VDDQ must be equal to VDD.
Data Sheet E1457E20 (Ver. 2.0)
10
EBE10UE8AFFA
AC Overshoot/Undershoot Specification (DDR2 SDRAM Component Specification)
Parameter Maximum peak amplitude allowed for overshoot Maximum peak amplitude allowed for undershoot Maximum overshoot area above VDD DDR2-800 DDR2-667 Maximum undershoot area below VSS DDR2-800 DDR2-667 Maximum peak amplitude allowed for overshoot Maximum peak amplitude allowed for undershoot Maximum overshoot area above VDD Maximum undershoot area below VSS Maximum peak amplitude allowed for overshoot Maximum peak amplitude allowed for undershoot Maximum overshoot area above VDDQ Maximum undershoot area below VSSQ DQ, DQS, /DQS, UDQS, /UDQS, LDQS, /LDQS, RDQS, /RDQS, DM, UDM, LDM CK, /CK Pins Command, Address, CKE, ODT Specification 0.5 0.5 0.66 0.8 0.66 0.8 0.5 0.5 0.23 0.23 0.5 0.5 0.23 0.23 Unit V V V-ns V-ns V-ns V-ns V V V-ns V-ns V V V-ns V-ns
Maximum amplitude Overshoot area
Volts (V)
VDD, VDDQ VSS, VSSQ
Undershoot area
Time (ns)
Overshoot/Undershoot Definition
Data Sheet E1457E20 (Ver. 2.0)
11
EBE10UE8AFFA
DC Characteristics 1 (TC = 0C to +85C, VDD = 1.8V 0.1V, VSS = 0V)
Parameter Symbol Grade max. Unit Test condition one bank; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS min.(IDD); CKE is H, /CS is H between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING one bank; IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS min.(IDD); tRCD = tRCD (IDD); CKE is H, /CS is H between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W all banks idle; tCK = tCK (IDD); CKE is L; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING all banks idle; tCK = tCK (IDD); CKE is H, /CS is H; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING all banks idle; tCK = tCK (IDD); CKE is H, /CS is H; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING all banks open; tCK = tCK (IDD); CKE is L; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING Fast PDN Exit MRS(12) = 0 Slow PDN Exit MRS(12) = 1
Operating current (ACT-PRE)
IDD0
-8G -6E
680 640
mA
Operating current (ACT-READ-PRE)
IDD1
-8G -6E
800 760
mA
Precharge power-down standby current
IDD2P
80
mA
Precharge quiet standby current
IDD2Q
-8G -6E
280 240
mA
Idle standby current
IDD2N
-8G -6E
320 280
mA
IDD3P-F Active power-down standby current IDD3P-S
280
mA
160
mA
Active standby current
IDD3N
-8G -6E
720 640
mA
all banks open; tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD); CKE is H, /CS is H between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING all banks open, continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD); CKE is H, /CS is H between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W all banks open, continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD); CKE is H, /CS is H between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Operating current (Burst read operating)
IDD4R
-8G -6E
1280 1120
mA
Operating current (Burst write operating)
IDD4W
-8G -6E
1280 1120
mA
Data Sheet E1457E20 (Ver. 2.0)
12
EBE10UE8AFFA
Parameter
Symbol
Grade
max.
Unit
Test condition tCK = tCK (IDD); Refresh command at every tRFC (IDD) interval; CKE is H, /CS is H between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING Self Refresh Mode; CK and /CK at 0V; CKE 0.2V; Other control and address bus inputs are FLOATING; Data bus inputs are FLOATING all bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD (IDD) -1 x tCK (IDD); tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD(IDD), tFAW = tFAW (IDD), tRCD = 1 x tCK (IDD); CKE is H, /CS is H between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4W;
Auto-refresh current
IDD5
-8G -6E
2320 2240
mA
Self-refresh current
IDD6
80
mA
Operating current (Bank interleaving)
IDD7
-8G -6E
2320 2200
mA
Notes: 1. 2. 3. 4. 5.
6.
IDD specifications are tested after the device is properly initialized. Input slew rate is specified by AC Input Test Condition. IDD parameters are specified with ODT disabled. Data bus consists of DQ, DM, DQS, /DQS, RDQS and /RDQS. IDD values must be met with all combinations of EMRS bits 10 and 11. Definitions for IDD L is defined as VIN VIL (AC) (max.) H is defined as VIN VIH (AC) (min.) STABLE is defined as inputs stable at an H or L level FLOATING is defined as inputs at VREF = VDDQ/2 SWITCHING is defined as: inputs changing between H and L every other clock cycle (once per two clocks) for address and control signals, and inputs changing between H and L every other data transfer (once per clock) for DQ signals not including masks or strobes. Refer to AC Timing for IDD Test Conditions.
Data Sheet E1457E20 (Ver. 2.0)
13
EBE10UE8AFFA
AC Timing for IDD Test Conditions For purposes of IDD testing, the following parameters are to be utilized.
DDR2-800 Parameter CL (IDD) tRCD (IDD) tRC (IDD) tRRD (IDD) tFAW (IDD) tCK (IDD) tRAS (min.)(IDD) tRAS (max.)(IDD) tRP (IDD) tRFC (IDD) 6-6-6 6 15 60 7.5 35 2.5 45 70000 15 127.5 DDR2-667 5-5-5 5 15 60 7.5 37.5 3 45 70000 15 127.5 Unit tCK ns ns ns ns ns ns ns ns ns
Data Sheet E1457E20 (Ver. 2.0)
14
EBE10UE8AFFA
DC Characteristics 2 (TC = 0C to +85C, VDD, VDDQ = 1.8V 0.1V) (DDR2 SDRAM Component Specification)
Parameter Input leakage current Output leakage current Symbol ILI ILO Value 2 5 VTT + 0.603 VTT - 0.603 0.5 x VDDQ +13.4 -13.4 Unit A A V V V mA mA Notes VDD VIN VSS VDDQ VOUT VSS 5 5 1 3, 4, 5 2, 4, 5
Minimum required output pull-up under AC VOH test load Maximum required output pull-down under VOL AC test load Output timing measurement reference level VOTR Output minimum sink DC current Output minimum source DC current IOL IOH
Notes: 1. 2. 3. 4. 5.
The VDDQ of the device under test is referenced. VDDQ = 1.7V; VOUT = 1.42V. VDDQ = 1.7V; VOUT = 0.28V. The DC value of VREF applied to the receiving device is expected to be set to VTT. After OCD calibration to 18 at TC = 25C, VDD = VDDQ = 1.8V.
DC Characteristics 3 (TC = 0C to +85C, VDD, VDDQ = 1.8V 0.1V) (DDR2 SDRAM Component Specification)
Parameter AC differential input voltage AC differential cross point voltage AC differential cross point voltage Symbol VID (AC) VIX (AC) VOX (AC) min. 0.5 0.5 x VDDQ - 0.175 0.5 x VDDQ - 0.125 max. VDDQ + 0.6 0.5 x VDDQ + 0.175 0.5 x VDDQ + 0.125 Unit V V V Notes 1, 2 2 3
Notes: 1.
2.
3.
VID (AC) specifies the input differential voltage |VTR -VCP| required for switching, where VTR is the true input signal (such as CK, DQS, RDQS) and VCP is the complementary input signal (such as /CK, /DQS, /RDQS). The minimum value is equal to VIH (AC) - VIL (AC). The typical value of VIX (AC) is expected to be about 0.5 x VDDQ of the transmitting device and VIX (AC) is expected to track variations in VDDQ. VIX (AC) indicates the voltage at which differential input signals must cross. The typical value of VOX (AC) is expected to be about 0.5 x VDDQ of the transmitting device and VOX (AC) is expected to track variations in VDDQ. VOX (AC) indicates the voltage at which differential output signals must cross.
VDDQ VTR
VID
VCP VSSQ
Crossing point
VIX or VOX
Differential Signal Levels*1, 2
Data Sheet E1457E20 (Ver. 2.0)
15
EBE10UE8AFFA
ODT DC Electrical Characteristics (TC = 0C to +85C, VDD, VDDQ = 1.8V 0.1V) (DDR2 SDRAM Component Specification)
Parameter Rtt effective impedance value for EMRS (A6, A2) = 0, 1; 75 Rtt effective impedance value for EMRS (A6, A2) = 1, 0; 150 Rtt effective impedance value for EMRS (A6, A2) = 1, 1; 50 Deviation of VM with respect to VDDQ/2 Symbol Rtt1(eff) Rtt2(eff) Rtt3(eff) VM min. 60 120 40 -6 typ. 75 150 50 max. 90 180 60 +6 Unit % Note 1 1 1 1
Note: 1.
Test condition for Rtt measurements.
Measurement Definition for Rtt (eff) Apply VIH (AC) and VIL (AC) to test pin separately, then measure current I(VIH (AC)) and I(VIL (AC)) respectively. VIH (AC), and VDDQ values defined in SSTL_18.
Rtt (eff ) =
VIH ( AC ) - VIL( AC ) I (VIH ( AC )) - I (VIL( AC ))
Measurement Definition for VM Measure voltage (VM) at test pin (midpoint) with no load.
2 x VM VM = - 1 x 100 VDDQ
OCD Default Characteristics (TC = 0C to +85C, VDD, VDDQ = 1.8V 0.1V) (DDR2 SDRAM Component Specification)
Parameter Output impedance Pull-up and pull-down mismatch Output slew rate min. 12.6 0 1.5 typ. 18 max. 23.4 4 5 Unit V/ns Notes 1, 5 1, 2 3, 4
Notes: 1.
2. 3. 4. 5.
Impedance measurement condition for output source DC current: VDDQ = 1.7V; VOUT = 1420mV; (VOUT-VDDQ)/IOH must be less than 23.4 for values of VOUT between VDDQ and VDDQ-280mV. Impedance measurement condition for output sink DC current: VDDQ = 1.7V; VOUT = 280mV; VOUT/IOL must be less than 23.4 for values of VOUT between 0V and 280mV. Mismatch is absolute value between pull up and pull down, both are measured at same temperature and voltage. Slew rate measured from VIL(AC) to VIH(AC). The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC to AC. This is guaranteed by design and characterization. DRAM I/O specifications for timing, voltage, and slew rate are no longer applicable if OCD is changed from default settings.
Data Sheet E1457E20 (Ver. 2.0)
16
EBE10UE8AFFA
Pin Capacitance (TA = 25C, VDD = 1.8V 0.1V) (DDR2 SDRAM Component Specification)
Parameter CLK input pin capacitance Input pin capacitance -8G -6E Symbol CCK Pins CK, /CK /RAS, /CAS, /WE, /CS, CKE, ODT, Address DQ, DQS, /DQS, UDQS, /UDQS, LDQS, /LDQS, RDQS, /RDQS, DM, UDM, LDM min. 1.0 1.0 1.0 max. 2.0 1.75 2.0 Unit pF pF pF Notes 1 1 1
CIN
Input/output pin capacitance
CI/O
2.5
3.5
pF
2
Notes: 1. 2.
Matching within 0.25pF. Matching within 0.50pF.
Data Sheet E1457E20 (Ver. 2.0)
17
EBE10UE8AFFA
AC Characteristics (TC = 0C to +85C, VDD, VDDQ = 1.8V 0.1V, VSS, VSSQ = 0V) (DDR2 SDRAM Component Specification) * New units tCK(avg) and nCK, are introduced in DDR2-800 and DDR2-667 tCK(avg): actual tCK(avg) of the input clock under operation. nCK: one clock cycle of the input clock, counting the actual clock edges.
-8G Speed bin Parameter Active to read or write command delay Precharge command period Symbol tRCD tRP DDR2-800 (6-6-6) min. 15 15 60 -400 -350 0.48 0.48 Min. (tCL(abs), tCH(abs)) 2500 3000 3750 5000 max. +400 +350 0.52 0.52 8000 8000 8000 8000 tAC max. tAC max. tAC max. 200 300 -6E DDR2-667 (5-5-5) min. 15 15 60 -450 -400 0.48 0.48 Min. (tCL(abs), tCH(abs)) 3000 3000 3750 5000 175 100 0.6 0.35 tAC min. 2 x tAC min max. +450 +400 0.52 0.52 8000 8000 8000 8000 tAC max. tAC max. tAC max. 240 340 Unit ns ns ns ps ps 10 10 Notes
Active to active/auto-refresh command time tRC DQ output access time from CK, /CK DQS output access time from CK, /CK CK high-level width CK low-level width CK half period Clock cycle time (CL = 6) (CL = 5) (CL = 4) (CL = 3) DQ and DM input hold time DQ and DM input setup time Control and Address input pulse width for each input tAC tDQSCK tCH (avg) tCL(avg) tHP tCK (avg) tCK (avg) tCK (avg) tCK (avg)
tCK (avg) 13 tCK (avg) 13 ps ps ps ps ps ps ps tCK (avg) tCK (avg) ps ps ps ps ps ps tCK (avg) tCK (avg) tCK (avg) tCK (avg) tCK (avg) nCK tCK (avg) tCK (avg) ps ps 5 4 7 8 10 10 10 6, 13 13 13 13 13 5 4
tDH (base) 125 tDS (base) 50 tIPW 0.6 0.35
DQ and DM input pulse width for each input tDIPW Data-out high-impedance time from CK,/CK tHZ DQS, /DQS low-impedance time from CK,/CK DQ low-impedance time from CK,/CK
tLZ (DQS) tAC min. tLZ (DQ) 2 x tAC min
DQS-DQ skew for DQS and associated DQ tDQSQ signals DQ hold skew factor DQ/DQS output hold time from DQS tQHS tQH
tHP - tQHS -0.25 0.35 0.35 0.2 0.2 2 0.4 0.35 +0.25 0.6 1.1
tHP - tQHS -0.25 0.35 0.35 0.2 0.2 2 0.4 0.35 275 200 0.9 +0.25 0.6 1.1
DQS latching rising transitions to associated tDQSS clock edges DQS input high pulse width DQS input low pulse width DQS falling edge to CK setup time DQS falling edge hold time from CK Mode register set command cycle time Write postamble Write preamble Address and control input hold time Address and control input setup time Read preamble tDQSH tDQSL tDSS tDSH tMRD tWPST tWPRE
tIH (base) 250 tIS (base) tRPRE 175 0.9
tCK (avg) 11
Data Sheet E1457E20 (Ver. 2.0)
18
EBE10UE8AFFA
-8G Speed bin Parameter Read postamble Active to precharge command Active to auto-precharge delay Active bank A to active bank B command period Four active window period /CAS to /CAS command delay Write recovery time Auto precharge write recovery + precharge time Internal write to read command delay Internal read to precharge command delay Exit self-refresh to a non-read command Exit self-refresh to a read command Symbol tRPST tRAS tRAP tRRD tFAW tCCD tWR tDAL tWTR tRTP tXSNR tXSRD DDR2-800 (6-6-6) min. 0.4 45 tRCD min. 7.5 35 2 15 WR + RU (tRP/ tCK (avg)) 7.5 7.5 tRFC + 10 200 2 2 8 - AL 3 0 0 127.5 tIS + tCK(avg) + tIH max. 0.6 70000 12 12 7.8 3.9 -6E DDR2-667 (5-5-5) min. 0.4 45 tRCD min. 7.5 37.5 2 15 WR + RU (tRP/ tCK (avg)) 7.5 7.5 tRFC + 10 200 2 2 7 - AL 3 0 0 127.5 tIS + tCK(avg) + tIH max. 0.6 70000 12 12 7.8 3.9 Unit Notes
tCK (avg) 12 ns ns ns ns nCK ns nCK ns ns ns nCK nCK nCK nCK nCK ns ns ns s s ns 3 2, 3 1, 9 14
Exit precharge power down to any non-read tXP command Exit active power down to read command Exit active power down to read command (slow exit/low power mode) CKE minimum pulse width (high and low pulse width) Output impedance test driver delay MRS command to ODT update delay Auto-refresh to active/auto-refresh command time Average periodic refresh interval (0C TC +85C) (+85C < TC +95C) tXARD tXARDS tCKE tOIT
tMOD
tRFC tREFI tREFI
Minimum time clocks remains ON after CKE tDELAY asynchronously drops low
Data Sheet E1457E20 (Ver. 2.0)
19
EBE10UE8AFFA
Notes: 1. 2. 3. 4. 5. For each of the terms above, if not already an integer, round to the next higher integer. AL: Additive Latency. MRS A12 bit defines which active power down exit timing to be applied. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under test. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the VIL(DC) level for a rising signal and VIH(DC) for a falling signal applied to the device under test.
DQS /DQS
CK /CK
tDS
tDH
tDS
tDH VDDQ VIH (AC)(min.) VIH (DC)(min.) VREF VIL (DC)(max.) VIL (AC)(max.) VSS
tIS
tIH
tIS
tIH VDDQ VIH (AC)(min.) VIH (DC)(min.) VREF VIL (DC)(max.) VIL (AC)(max.) VSS
Input Waveform Timing 1 (tDS, tDH)
Input Waveform Timing 2 (tIS, tIH)
tHP is the minimum of the absolute half period of the actual input clock. tHP is an input parameter but not an input specification parameter. It is used in conjunction with tQHS to derive the DRAM output timing tQH. The value to be used for tQH calculation is determined by the following equation; tHP = min ( tCH(abs), tCL(abs) ), where, tCH(abs) is the minimum of the actual instantaneous clock high time; tCL(abs) is the minimum of the actual instantaneous clock low time; 7. tQHS accounts for: a. The pulse duration distortion of on-chip clock circuits, which represents how well the actual tHP at the input is transferred to the output; and b. The worst case push-out of DQS on one transition followed by the worst case pull-in of DQ on the next transition, both of which are independent of each other, due to data pin skew, output pattern effects, and p-channel to n-channel variation of the output drivers. 8. tQH = tHP - tQHS, where: tHP is the minimum of the absolute half period of the actual input clock; and tQHS is the specification value under the max column. {The less half-pulse width distortion present, the larger the tQH value is; and the larger the valid data eye will be.} Examples: a. If the system provides tHP of 1315ps into a DDR2-667 SDRAM, the DRAM provides tQH of 975ps (min.) b. If the system provides tHP of 1420ps into a DDR2-667 SDRAM, the DRAM provides tQH of 1080ps (min.) 9. RU stands for round up. WR refers to the tWR parameter stored in the MRS. 10. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tERR(6-10per) of the input clock. (output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR2-667 SDRAM has tERR(6-10per) min. = -272ps and tERR(6-10per) max. = +293ps, then tDQSCK min.(derated) = tDQSCK min. - tERR(6-10per) max. = -400ps - 293ps = -693ps and tDQSCK max.(derated) = tDQSCK max. - tERR(6-10per) min. = 400ps + 272ps = +672ps. Similarly, tLZ(DQ) for DDR2-667 derates to tLZ(DQ) min.(derated) = -900ps - 293ps = -1193ps and tLZ(DQ) max.(derated)= 450ps + 272ps = +722ps.
6.
Data Sheet E1457E20 (Ver. 2.0)
20
EBE10UE8AFFA
11. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tJIT(per) of the input clock. (output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR2-667 SDRAM has tJIT(per) min. = -72ps and tJIT(per) max. = +93ps, then tRPRE min.(derated) = tRPRE min. + tJIT(per) min. = 0.9 x tCK(avg) - 72ps = +2178ps and tRPRE max.(derated) = tRPRE max. + tJIT(per) max. = 1.1 x tCK(avg) + 93ps = +2843ps. 12. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tJIT(duty) of the input clock. (output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR2-667 SDRAM has tJIT(duty) min. = -72ps and tJIT(duty) max. = +93ps, then tRPST min.(derated) = tRPST min. + tJIT(duty) min. = 0.4 x tCK(avg) - 72ps = +928ps and tRPST max.(derated) = tRPST max. + tJIT(duty) max. = 0.6 x tCK(avg) + 93ps = +1592ps. 13. Refer to the Clock Jitter table. 14. tWTR is at least two clocks (2 x tCK or 2 x nCK) independent of operation frequency.
Data Sheet E1457E20 (Ver. 2.0)
21
EBE10UE8AFFA
ODT AC Electrical Characteristics (DDR2 SDRAM Component Specification)
Parameter ODT turn-on delay ODT turn-on ODT turn-on (power down mode) ODT turn-off delay ODT turn-off ODT turn-off (power down mode) ODT to power down entry latency ODT power down exit latency Symbol tAOND tAON tAONPD tAOFD tAOF tAOFPD tANPD tAXPD min. 2 tAC (min) tAC(min) + 2000 2.5 tAC(min) tAC(min) + 2000 3 8 max. 2 tAC (max) + 700 2tCK + tAC(max) + 1000 2.5 tAC(max) + 600 2.5tCK + tAC(max) + 1000 3 8 Unit tCK ps ps tCK ps ps tCK tCK 5 2, 4, 5 1, 3 Notes
Notes: 1. 2. 3. 4.
5.
ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on. ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND. ODT turn off time min is when the device starts to turn off ODT resistance. ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tERR(6-10per) of the input clock. (output deratings are relative to the SDRAM input clock.) When the device is operated with input clock jitter, this parameter needs to be derated by {-tJIT(duty) max. - tERR(6-10per) max. } and { -tJIT(duty) min. - tERR(6-10per) min. } of the actual input clock.(output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR2-667 SDRAM has tERR(6-10per) min. = -272ps, tERR(6-10per) max. = +293ps, tJIT(duty) min. = -106ps and tJIT(duty) max. = +94ps, then tAOF min.(derated) = tAOF min. + { -tJIT(duty) max. - tERR(6-10per) max. } = -450ps + { -94ps - 293ps} = -837ps and tAOF max.(derated) = tAOF max. + { -tJIT(duty) min. - tERR(6-10per) min. } = 1050ps + { 106ps + 272ps} = +1428ps. For tAOFD of DDR2-667/800, the 1/2 clock of nCK in the 2.5 x nCK assumes a tCH(avg), average input clock high pulse width of 0.5 relative to tCK(avg). tAOF min. and tAOF max. should each be derated by the same amount as the actual amount of tCH(avg) offset present at the DRAM input with respect to 0.5. For example, if an input clock has a worst case tCH(avg) of 0.48, the tAOF min. should be derated by subtracting 0.02 x tCK(avg) from it, whereas if an input clock has a worst case tCH(avg) of 0.52, the tAOF max. should be derated by adding 0.02 x tCK(avg) to it. Therefore, we have; tAOF min.(derated) = tAC min. - [0.5 - Min.(0.5, tCH(avg) min.)] x tCK(avg) tAOF max.(derated) = tAC max. + 0.6 + [Max.(0.5, tCH(avg) max.) - 0.5] x tCK(avg) or tAOF min.(derated) = Min.(tAC min., tAC min. - [0.5 - tCH(avg) min.] x tCK(avg)) tAOF max.(derated) = 0.6 + Max.(tAC max., tAC max. + [tCH(avg) max. - 0.5] x tCK(avg)) where tCH(avg) min. and tCH(avg) max. are the minimum and maximum of tCH(avg) actually measured at the DRAM input balls.
Data Sheet E1457E20 (Ver. 2.0)
22
EBE10UE8AFFA
AC Input Test Conditions (DDR2 SDRAM Component Specification)
Parameter Input reference voltage Input signal maximum peak to peak swing Input signal minimum slew rate Symbol VREF VSWING (max.) SLEW Value 0.5 x VDDQ 1.0 1.0 Unit V V V/ns Notes 1 1 2, 3
Notes: 1. 2. 3.
Input waveform timing is referenced to the input signal crossing through the VIH/IL (AC) level applied to the device under test. The input signal minimum slew rate is to be maintained over the range from VREF to VIH (AC) min. for rising edges and the range from VREF to VIL (AC) max. for falling edges as shown in the below figure. AC timings are referenced with input waveforms switching from VIL (AC) to VIH (AC) on the positive transitions and VIH (AC) to VIL (AC) on the negative transitions.
VDDQ VIH (AC)(min.) VIH (DC)(min.)
VSWING(max.)
VREF VIL (DC)(max.) VIL (AC)(max.)
TF Falling slew = VREF
TR
Rising slew =
VSS
VIH (AC) min. - VREF TR
- VIL (AC)(max.)
TF
AC Input Test Signal Wave forms
Measurement point
DQ RT =25
VTT
Output Load
Data Sheet E1457E20 (Ver. 2.0)
23
EBE10UE8AFFA
Clock Jitter
-8G Frequency (Mbps) Parameter Average clock period Clock period jitter Clock period jitter during DLL locking period Cycle to cycle period jitter Cycle to cycle clock period jitter during DLL locking period Cumulative error across 2 cycles Cumulative error across 3 cycles Cumulative error across 4 cycles Cumulative error across 5 cycles Cumulative error across n=6,7,8,9,10 cycles Cumulative error across n=11, 12,...49,50 cycles Average high pulse width Average low pulse width Duty cycle jitter Symbol tCK (avg) tJIT (per) tJIT (per, lck) tJIT (cc) 800 min. 2500 -100 -80 max. 8000 100 80 200 160 150 175 200 200 300 450 0.52 0.52 100 -6E 667 min. 3000 -125 -100 -175 -225 -250 -250 -350 -450 0.48 0.48 -125 max. 8000 125 100 250 200 175 225 250 250 350 450 0.52 0.52 125 Unit ps ps ps ps ps ps ps ps ps ps ps tCK (avg) tCK (avg) ps Notes 1 5 5 6 6 7 7 7 7 7 7 2 3 4
tJIT (cc, lck) tERR (2per) -150 tERR (3per) -175 tERR (4per) -200 tERR (5per) -200 tERR (6-10per) tERR (11-50per) tCH (avg) tCL (avg) tJIT (duty) -300 -450 0.48 0.48 -100
Notes: 1.
tCK (avg) is calculated as the average clock period across any consecutive 200cycle window.
N tCK (avg ) = tCKj N j =1
2. N = 200 tCH (avg) is defined as the average high pulse width, as calculated across any consecutive 200 high pulses.
N tCH (avg ) = tCHj (N x tCK (avg )) j =1
3. N = 200 tCL (avg) is defined as the average low pulse width, as calculated across any consecutive 200 low pulses.
N tCL(avg ) = tCLj (N x tCK (avg )) j =1
4. N = 200 tJIT (duty) is defined as the cumulative set of tCH jitter and tCL jitter. tCH jitter is the largest deviation of any single tCH from tCH (avg). tCL jitter is the largest deviation of any single tCL from tCL (avg). tJIT (duty) is not subject to production test. tJIT (duty) = Min./Max. of {tJIT (CH), tJIT (CL)}, where: tJIT (CH) = {tCHj- tCH (avg) where j = 1 to 200} tJIT (CL) = {tCLj - tCL (avg) where j = 1 to 200} tJIT (per) is defined as the largest deviation of any single tCK from tCK (avg). tJIT (per) = Min./Max. of { tCKj - tCK (avg) where j = 1 to 200} tJIT (per) defines the single period jitter when the DLL is already locked. tJIT (per, lck) uses the same definition for single period jitter, during the DLL locking period only. tJIT (per) and tJIT (per, lck) are not subject to production test.
5.
Data Sheet E1457E20 (Ver. 2.0)
24
EBE10UE8AFFA
6. tJIT (cc) is defined as the absolute difference in clock period between two consecutive clock cycles: tJIT (cc) = Max. of |tCKj+1 - tCKj| tJIT (cc) is defines the cycle to cycle jitter when the DLL is already locked. tJIT (cc, lck) uses the same definition for cycle to cycle jitter, during the DLL locking period only. tJIT (cc) and tJIT (cc, lck) are not subject to production test. tERR (nper) is defined as the cumulative error across multiple consecutive cycles from tCK (avg). tERR (nper) is not subject to production test.
7.
n tERR(nper ) = tCKj - n x tCK(avg )) j =1
8. 2 n 50 for tERR (nper) These parameters are specified per their average values, however it is understood that the following relationship between the average timing and the absolute instantaneous timing hold at all times. (minimum and maximum of spec values are to be used for calculations in the table below.)
Parameter Absolute clock period Absolute clock high pulse width Absolute clock low pulse width Symbol tCK (abs) tCH (abs) tCL (abs) min. tCK (avg) min. + tJIT (per) min. tCH (avg) min. x tCK (avg) min. + tJIT (duty) min. tCL (avg) min. x tCK (avg) min. + tJIT (duty) min. max. Unit tCK (avg) max. + tJIT (per) max. ps tCH (avg) max. x tCK (avg) max. ps + tJIT (duty) max. tCL (avg) max. x tCK (avg) max. ps + tJIT (duty) max.
Example: For DDR2-667, tCH(abs) min. = ( 0.48 x 3000 ps ) - 125ps = 1315ps
Data Sheet E1457E20 (Ver. 2.0)
25
EBE10UE8AFFA
Pin Functions
CK, /CK (input pin) The CK and the /CK are the master clock inputs. All inputs except DMs, DQSs and DQs are referred to the cross point of the CK rising edge and the VREF level. When a read operation, DQSs and DQs are referred to the cross point of the CK and the /CK. When a write operation, DMs and DQs are referred to the cross point of the DQS and the VREF level. DQSs for write operation are referred to the cross point of the CK and the /CK. /CS (input pin) When /CS is low, commands and data can be input. When /CS is high, all inputs are ignored. However, internal operations (bank active, burst operations, etc.) are held. /RAS, /CAS, and /WE (input pins) These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels. See "Command operation". A0 to A13 (input pins) Row address (AX0 to AX13) is determined by the A0 to the A13 level at the cross point of the CK rising edge and the VREF level in a bank active command cycle. Column address (AY0 to AY9) is loaded via the A0 to the A9 at the cross point of the CK rising edge and the VREF level in a read or a write command cycle. This column address becomes the starting address of a burst operation. A10 (AP) (input pin) A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If A10 = high when a precharge command is issued, all banks are precharged. If A10 = low when a precharge command is issued, only the bank that is selected by BA1, BA0 is precharged. If A10 = high when read or write command, auto-precharge function is enabled. While A10 = low, auto-precharge function is disabled. BA0, BA1, BA2 (input pin) BA0, BA1 and BA2 are bank select signals (BA). The memory array is divided into 8 banks: bank 0 to bank 7. (See Bank Select Signal Table) [Bank Select Signal Table]
BA0 Bank 0 Bank 1 Bank 2 Bank 3 Bank 4 Bank 5 Bank 6 Bank 7 L H L H L H L H BA1 L L H H L L H H BA2 L L L L H H H H
Remark: H: VIH. L: VIL.
Data Sheet E1457E20 (Ver. 2.0)
26
EBE10UE8AFFA
CKE (input pin) CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the CKE is driven low and exited when it resumes to high. The CKE level must be kept for 1 CK cycle at least, that is, if CKE changes at the cross point of the CK rising edge and the VREF level with proper setup time tIS, at the next CK rising edge CKE level must be kept with proper hold time tIH. DQ (input and output pins) Data are input to and output from these pins. DQS and /DQS (input and output pin) DQS and /DQS provide the read data strobes (as output) and the write data strobes (as input). DM (input pins) DM is the reference signal of the data input mask function. DMs are sampled at the cross point of DQS and /DQS. VDD (power supply pins) 1.8V is applied. (VDD is for the internal circuit.) VDDSPD (power supply pin) 1.8V is applied (For serial EEPROM). VSS (power supply pin) Ground is connected.
Detailed Operation Part and Timing Waveforms
Refer to the EDE1108AFSE datasheet (E1390E).
Data Sheet E1457E20 (Ver. 2.0)
27
EBE10UE8AFFA
Physical Outline
Unit: mm
3.18 max 3.00 (DATUM -A-) 0.5 min
1
120
B 63.00 133.35 55.00
A 1.27 0.10
240
10.00
121
17.80
4.00 min
Component area (Front)
(Back)
4.00
FULL R
Detail A
2.50 0.20
Detail B 1.00 4.00
0.20 0.15
(DATUM -A-)
2.50 FULL R
5.00
3.80
0.80 0.05
1.50 0.10
ECA-TS2-0126-02
Data Sheet E1457E20 (Ver. 2.0)
28
30.00
EBE10UE8AFFA
CAUTION FOR HANDLING MEMORY MODULES
When handling or inserting memory modules, be sure not to touch any components on the modules, such as the memory ICs, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these components to prevent damaging them. In particular, do not push module cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. When re-packing memory modules, be sure the modules are not touching each other. Modules in contact with other modules may cause excessive mechanical stress, which may damage the modules.
MDE0202
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR MOS DEVICES
Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES
No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function.
CME0107
Data Sheet E1457E20 (Ver. 2.0)
29
EBE10UE8AFFA
The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Be aware that this product is for use in typical electronic equipment for general-purpose applications. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] Usage in environments with special characteristics as listed below was not considered in the design. Accordingly, our company assumes no responsibility for loss of a customer or a third party when used in environments with the special characteristics listed below. Example: 1) Usage in liquids, including water, oils, chemicals and organic solvents. 2) Usage in exposure to direct sunlight or the outdoors, or in dusty places. 3) Usage involving exposure to significant amounts of corrosive gas, including sea air, CL 2 , H 2 S, NH 3 , SO 2 , and NO x . 4) Usage in environments with static electricity, or strong electromagnetic waves or radiation. 5) Usage in places where dew forms. 6) Usage in environments with mechanical vibration, impact, or stress. 7) Usage near heating elements, igniters, or flammable items. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations.
M01E0706
Data Sheet E1457E20 (Ver. 2.0)
30

▲Up To Search▲

Price & Availability of EBE10UE8AFFA

	To Download EBE10UE8AFFA Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .